Characteristics
These materials are defined by ultra-high purity (to prevent micro-contamination), precise chemical composition, and exceptional consistency. They often possess specific reactivity or physical properties, such as photosensitivity, selective etch rates, and thermal stability.
Uses
They are essential in semiconductor manufacturing for patterning circuits (photoresists), etching layers (acids), depositing films (CVD precursors), and polishing wafers (CMP slurries). In electronics assembly, they are used for plating PCB traces, soldering components (solder paste/flux), and printing conductive pathways.
They are essential in the manufacturing, processing, cleaning, and performance optimization of electronic components and devices, such as semiconductors, displays, printed circuit boards, and energy storage systems.
Major types include etchants and cleaners (acids, solvents), photoresists, dopants, conductive inks and pastes, plating chemicals, packaging materials, and high-purity specialty gases.
Even trace impurities can severely impact the performance, reliability, and production yield of sensitive electronics, especially in semiconductor fabrication, where nanometer-scale precision is required.